| 摘要 |
PROBLEM TO BE SOLVED: To provide an efficient manufacturing method of an electronic device with high reliability, and to provide a semiconductor device excellent in mounting capability. SOLUTION: The method of manufacturing an electronic device comprises: a process for preparing a semiconductor device 1 having a semiconductor chip 10 wherein an electrode 14 is formed, two or more first portions 21 formed in the surface 15 of the semiconductor chip 10, a resin projection 20 which is arranged between the first portions 21 and includes second portions 22 whose height is lower than that of the first portion 21, and wiring 40 which has an electric connection area 42 arranged on the first portion 21; a process for preparing a wiring substrate 50 having a base substrate 52 and a wiring pattern 54; and a process for mounting the semiconductor device 1 in the wiring substrate 50 and for carrying out electric connection by bringing the electric connection area and the wiring pattern in to contact. In the process for mounting the semiconductor device in the wiring substrate, the second portion 22 is brought into contact with the wiring substrate 50, after bringing the electric connection area and the wiring pattern into contact. COPYRIGHT: (C)2008,JPO&INPIT
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