<p>An IC tag label (1A) is provided with an inlet base material (11); an antenna pattern (2) and an IC chip (3) arranged on one surface of the inlet base material (11); and an adhesive layer (6) arranged on the other surface of the inlet base material (11). A peeling sheet (7) is arranged on the adhesive layer (6). An opening (12) to be the back clearance for the IC chip (3) is arranged on the peeling sheet (7) and the adhesive layer (6), at a portion that corresponds to the IC chip (3).</p>
申请公布号
WO2008047705(A1)
申请公布日期
2008.04.24
申请号
WO2007JP69947
申请日期
2007.10.12
申请人
DAI NIPPON PRINTING CO., LTD.;OGATA, TETSUJI;SAKATA, HIDETO