WIRING BOARD, MULTILAYER WIRING BOARD, AND ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF THESE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and a multilayer wiring board which suppress the possibilities of corrosion of electrode interconnections formed on the surface of an insulation substrate and of short circuits between the electrode interconnections, and also to provide a manufacturing method of the multilayer wiring board and an electronic device having a high reliability. SOLUTION: The wiring board includes a plurality of electrode interconnections 2 on the surface of the insulation substrate 1. The electrode interconnections 2 include a metal interconnection layer 2a formed on the surface of the insulation substrate 1. The wiring board also includes an insulation portion 4 for covering the metal interconnection layer 2a over the width direction of that layer 2a. COPYRIGHT: (C)2008,JPO&INPIT