| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of easily inspecting outer appearance, and to provide its manufacturing method. SOLUTION: The semiconductor device includes: a semiconductor sensor device in which an acceleration sensor element 100 is mounted by flip-flop on a processing circuit element 200 via a bump 40a for a sensor; and a wiring board 300 for electrically connecting the semiconductor sensor device to an external device. The semiconductor sensor device is mounted by flip-flop on the wiring board 300 via a bump 40b for a circuit. The wiring board 300 has a flat surface 340 where a substantially flat surface is obtained at least between a part, where the bump 40b for the circuit is connected, and the end part of the wiring board 300. COPYRIGHT: (C)2008,JPO&INPIT |
