Light emitting diode system, method for producing such a system, and backlighting device

摘要

A light-emitting diode system ( 1 ) comprising at least one light-emitting diode component ( 2 ), in which a light-emitting diode chip is arranged in a light-emitting diode housing ( 21 ) on a heat sink ( 22 ) which can be thermally connected at the rear side ( 25 ) of the light-emitting diode housing ( 21 ). A carrier plate ( 3 ) having a front side ( 34 ) and a rear side ( 31 ) and a hole for receiving the light-emitting diode component ( 2 ) is provided. The light-emitting diode component ( 2 ) projects into the hole from the rear side ( 31 ) of the carrier plate ( 3 ). An electrically insulating thermal connection layer ( 5 ) is applied at the rear side ( 31 ) of the carrier plate ( 3 ), said thermal connection layer being thermally conductively connected to the heat sink ( 22 ). A method for producing a light-emitting diode system is also described.