| 摘要 |
PROBLEM TO BE SOLVED: To increase yields by eliminating layer displacement due to irregularities in elements, and to eliminate a decrease in an ESR value caused by the squeeze-out and spread of a conductive adhesive when laminating a capacitor element. SOLUTION: The shape of a lead frame for collecting power used when manufacturing a laminated solid capacitor is devised, and pocket type lead frames especially for forming a square wall structure at the corner of a capacitor element mount surface by allowing a wall section to cooperate with a sidewall in the bent structure of an extraction section (1), or partially providing the sidewall at either side of a surface for mounting the capacitor element (2) are provided, thus restraining lamination deviation following irregularities in the element and squeeze-out and spread of a conductor for adhesion in lamination, and hence providing a solid electrolytic capacitor having high lamination efficiency and low ESR. COPYRIGHT: (C)2008,JPO&INPIT |
