| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface treatment method for copper where uniform ruggedness can be formed on the surface of a copper surface without forming ruggedness exceeding 1 μm, and the adoption of a horizontal carrier system having excellent productivity is made possible. <P>SOLUTION: The surface treatment method for copper where surface treatment for copper is performed by a horizontal carrier system comprises: a stage where a metal nobler than copper is discretely formed on the surface of copper; and a stage where the copper surface is thereafter subjected to oxidation treatment with an alkaline solution comprising an oxidizer. Further, the wiring board and semiconductor package applying the method are provided. <P>COPYRIGHT: (C)2008,JPO&INPIT |
