| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device of a 3D structure which is high in practicality and productivity. SOLUTION: The semiconductor device comprises a substrate having a nearly square shape, an array of terminals arranged at an end on one side of the substrate, and a plurality of semiconductor integrated chips of nearly the same shape having a plurality of regions of planar inductors formed to have a center offset from the center of the substrate in a direction opposed to the terminal array. Between semiconductor integrated chips, the upper position of the planar inductor of one of the chips is aligned with the lower position of the planar inductor of the other chip so that one chip attains information communication via the planar inductor of the other chip. Adjacent semiconductor integrated chips are vertically laminated so that the terminal array of one chip forms an angle of 180 degrees with the terminal array of the other chip, and these terminal arrays are interconnected with wire bond for power supply. COPYRIGHT: (C)2008,JPO&INPIT |
