发明名称 MULTILAYER SHEET FOR MOLDED PACKAGE, MOLDED PACKAGE, AND MANUFACTURING METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer sheet for a molded package, the molded package and a manufacturing method therefor which can attain a superior unsealability opening by folding at a slit line (a folding line) of the molded package, prevent melting and adhering of the slit line at the time of heating and molding operation when the molded package is manufactured by heating and forming a location including the slit line in the sheet, and keep superior performances such as moldability, moisture resistance and a gas barrier functionality. <P>SOLUTION: A slit line 131 in a multilayer sheet for a molded package having one or more other layers 101, 102 on a resin layer 103 made of resin compound including polypropylene resin and petroleum resin passes from the outer-most layers of other layers 101, 102 through the other layers 101, 102 and is formed within the resin layer 103. A depth h2 of the slut line 131 formed within the resin layer 103 is adjusted to become within a predetermined range in respect to a thickness h1 of the resin layer 103 and a thickness h3 of the multilayer sheet for the molded package having no slit line formed therein is adjusted to become within a predetermined range. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008087829(A) 申请公布日期 2008.04.17
申请号 JP20060271591 申请日期 2006.10.03
申请人 SUMITOMO BAKELITE CO LTD 发明人 NAKAJIMA YOHEI
分类号 B65D65/30;B65D1/00;B65D65/40;B65D77/30 主分类号 B65D65/30
代理机构 代理人
主权项
地址