| 摘要 |
PROBLEM TO BE SOLVED: To efficiently perform radiation so as to reduce heat resistance in a semiconductor device by arranging a highly heat-conductive metallic member in contact with a mounting substrate, a semiconductor chip, and a sealing resin. SOLUTION: The semiconductor chip 20 with a bump 21 arranged on one surface as an external terminal and a plurality of chip components 30 are electrically connected to a wiring circuit 11, and then, mounted on the mounting substrate 10, where the wiring circuit 11 is arranged on one main surface and the external terminal 12 to be electrically connected to the wiring circuit 11 is arranged on the other main surface, concerning the semiconductor device. A box shape metallic member 40 with one open surface is arranged on the mounting substrate 10, so as to cover the wiring circuit 11, the semiconductor chip 20, and the chip components 30 formed or mounted on the mounting substrate 10. A gap between the mounting substrate 10 and the metallic member 40 is sealed with a sealing resin 50. The box shape metallic member 40 is brought into contact with the mounting substrate 10 at the end part and contact with the semiconductor chip 20 and the sealing resin 50 on the inner surface. COPYRIGHT: (C)2008,JPO&INPIT
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