| 摘要 |
An unoccupied space on a BGA package is utilized effectively to reduce cost. In a semiconductor integrated circuit device in which the lower surface 1 a of a BGA package 1 has many ball-shaped terminals 2 arranged in a central section D 1 and a peripheral section D 2 thereon in a grid pattern of multiple lines and an approximately rectangular-shaped hollow section D 3 is formed between the central section D 1 and the peripheral section D 2 on the lower surface 1 a, while a mounting area E is formed in place on one surface 3 a of a printed-wiring substrate 3 in such a manner as to face the BGA package 1 , the mounting area E including many lands 5 arranged in a central area E 1 and a peripheral area E 2 thereon in a grid pattern of multiple lines in such a manner as to face the respective ball-shaped terminals 2 , and an approximately rectangular-shaped middle area E 3 is formed between the central area E 1 and the peripheral area E 2 in the mounting area E, where the BGA package 1 is adapted to be mounted on the one surface 3 a of the printed-wiring substrate 3 , a peripheral circuit C including various electronic components Ca is provided in the middle area E 3 in the mounting area E.
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