APPARATUS FOR MANUFACTURING A SEMICONDUCTOR PACKAGE

摘要

An apparatus for manufacturing a semiconductor package is provided to remove foreign substances remaining on the semiconductor package in advance and to increase cleaning period of a socket by using a vacuum absorbing unit. A shuttle unit(230) mounts a semiconductor package and includes plural mounting regions(232) whose sides are opened. A connecting unit(236) is connected to a side of the shuttle unit to include at least one mounting region. A vacuum absorbing unit(240) is connected to the connecting unit to remove foreign substances remaining on the mounting region by a pressure difference. The mounting regions include plural stoppers(234) for supporting the semiconductor package. The stoppers are protruded from an inner surface of the mounting region. The connecting unit is fixed. The shuttle unit moves to be connected to the connecting unit. A spray unit(238) sprays compressed air to the mounting region.