发明名称 COMPOSITION OF ETCHING SOLUTIONS FOR MULTILAYERS OF CU AND MOLYBDENUM
摘要 An etchant composition for a multilayer comprising copper and molybdenum is provided to remove the problem of instability and to prevent the generation of etching residue and the decrease of brightness. An etchant composition for a multilayer comprising copper and molybdenum comprises 1-30 wt% of CuCl2; 0.5-5 wt% of an organic acid; 0.2-5 wt% of a phosphate salt; 0.2-5 wt% of a first nitrogen-containing additive; 0.2-5 wt% of a second nitrogen-containing additive; 0.01-1.0 wt% of a fluorine compound; and the balance of deionized water. Preferably the organic acid is selected from acetic acid, butanoic acid, citric acid, formic acid, gluconic acid, glycolic acid, malonic acid, oxalic acid, pentanoic acid and other water-soluble organic acids.
申请公布号 KR20080024818(A) 申请公布日期 2008.03.19
申请号 KR20060089468 申请日期 2006.09.15
申请人 DONGWOO FINE-CHEM CO., LTD. 发明人 LEE, SUK;CHOI, YONG SUK;YOON, YOUNG JIN
分类号 C09K13/06;C09K13/08 主分类号 C09K13/06
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