| 摘要 |
An analog die (3) and a digital die (4) are supported by a plate (1) consisting of an electrically conductive material. Pads (5) of the dies (3, 4) are connected to each other, to plate (1) or to pins (2) surrounding the latter by bond wires (6). The upper side of the plate (1) is covered by a plastic mold (7) encapsulating the dies (3, 4), the bond wires (6) and, in part, the pins (2). For the suppression of external jamming signals as well as internal ones picked up by bond wires the digital die (4) comprises an adjustable notch filter which suppresses narrow frequency bands where jamming signals have been detected. |
