| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily manufacture a simple-to-handle infrared data communication module. SOLUTION: This method of manufacturing an infrared data communication module comprises a step of sealing light-emitting elements 2 and light-receiving elements mounted on a substrate 1, using a resin package 4 which has a plurality of side surfaces 40 erecting from the substrate 1. The method also comprises a step of cutting both the package 4 and the substrate 1 in the direction of their thickness, so as to remove at least one of the side surfaces 40 of the package 4 in whole or in part.</p> |
