| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a combination IC card which hardly causes cracks, when an external stress is applied to the card substrate and is highly resistant to bending by adequately routing copper wires at the contact point of an IC module and antenna. <P>SOLUTION: In the combination IC card, the antenna 2, comprising the copper wires preliminarily embedded in an optional position of the card substrate 1 in a loop form, is connected to the IC module 3 embedded in a concave part 6 clipped in a prescribed depth at an optional position of the card substrate 1. In this case, a copper wire exposure connection part 4, which connects the antenna 2 with the IC module 3 is provided with antenna tip routing copper wires 5 for connecting the IC module, and the routing copper wires 5 are arranged so that they are not be parallel to a clipped tomographic surface 7, which is clipped to embed the IC module 3 in the card substrate 1. <P>COPYRIGHT: (C)2004,JPO</p> |
