SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

摘要

A semiconductor device and a manufacturing method thereof are provided to efficiently perform heat dissipation by transmitting heat generated in a semiconductor device to a second heat dissipation member through a first heat dissipation member. A first heat dissipation member(3) is arranged on a wire substrate(1) by using an adhesive agent(2). A semiconductor device(5) is adhered to the first heat dissipation member by using an adhesive agent(4). Electrodes on the semiconductor device and the wire substrate are connected by a wire(6). A second heat dissipation member(8) covering the semiconductor device and the wire is adhered to the first heat dissipation member by using a conductive adhesive agent(7). An inner side of the second heat dissipation member and an external part except for a flat panel unit(8c) thereof are sealed by a resin(9) to configure a semiconductor device(100). Heat generated in the semiconductor device and conducted to the first heat dissipation member is transmitted to the conductive adhesive agent and the second heat dissipation member to be released from the flat panel unit.