| 摘要 |
A pad conditioning apparatus in semiconductor device manufacturing equipment is provided to perform a rapid pad conditioning, to improve uniformity of a pad conditioning, and to remove a slurry remaining in a pad groove by performing a brushing operation during the pad conditioning. A pad conditioner shaft(51) is movable in a first direction with respect to a pad(30). A pad conditioner arm(54) is connected to the pad conditioner shaft. The pad conditioner arm is movable in a second direction almost perpendicular to the first direction. A conditioning disk is mounted on the pad conditioner arm to condition the pad by being moved in the first and second directions. The conditioning disk is a roller disk rotated in synchronized with a revolution direction of the pad. The conditioning disk includes a diamond grid coating unit and brush units. The brush units are separated from the diamond grid coating unit and formed on a surface of the disk to remove a slurry remaining within a groove of the pad.
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