发明名称 |
Semiconductive Device Having Improved Copper Density for Package-on-Package Applications |
摘要 |
In one aspect, the invention provides a semiconductor device that comprises a semiconductor device packaging substrate core. A first interconnect structure is located within a mold region and on a die side of the substrate core and has a first conductive metal density associated therewith. A second interconnect structure is located within the mold region and on a solder joint side of the substrate core and has a second conductive metal density associated therewith, wherein the second conductive metal density within the mold region is about equal to or less than the first conductive metal density within the mold region. |
申请公布号 |
US2008048303(A1) |
申请公布日期 |
2008.02.28 |
申请号 |
US20060466219 |
申请日期 |
2006.08.22 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
AMAGAI MASAZUMI;MASUMOTO KENJI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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