| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be easily reduced in size and thickness. <P>SOLUTION: In the semiconductor device 1, an optical semiconductor element 10, metal plates 31, 32 and bumps 41, 42 are sealed with a resin 50. The metal plates 31, 32 are respectively electrically connected to electrode pads 11, 12 on the bottom surface of the optical semiconductor element 10 via the bumps 41, 42, and are used as external connection terminals. The bottom surfaces of the metal plates 31, 32 are provided on a common virtual plane. The optical semiconductor element 10 and the bumps 41, 42 are covered with a resin 50 provided on one side for the virtual plane. The top surfaces and side surfaces of the metal plates 31, 32 are also covered with the resin 50. The bottom surfaces of the metal plates 31, 32 are not covered with the resin 50, but exposed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
