发明名称 CHIP CARRIER FOR SEMICONDUCTOR OPTICAL ELEMENT, OPTICAL MODULE, AND OPTICAL TRANSCEIVER
摘要 PROBLEM TO BE SOLVED: To prevent the frequency characteristics of a semiconductor optical element from being deteriorated when the semiconductor optical element having a capacitance is incorporated in an optical module and an optical transceiver. SOLUTION: The optical module and the optical transceiver are configured by using a chip carrier in which a high frequency transmission line 102, a grounding metallic coating part 103, and a termination resistor 104 are arranged on a dielectric body whose backside is metallic-coated or the surface of a semiconductor substrate 101, the metallic coating part 103 on the substrate surface and the metallic coating part on the backside are electrically connected by a via-hole 105 made of metal and a metallic coated substrate side face 122; the semiconductor optical element 110 is fixed to the metallic coating part on the substrate surface, and the high frequency transmission line 102 and the semiconductor optical element 110 are connected by wire bonding 106 to 108. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008047942(A) 申请公布日期 2008.02.28
申请号 JP20070282630 申请日期 2007.10.31
申请人 OPNEXT JAPAN INC 发明人 SASADA NORIKO;NAOE KAZUHIKO;SHIRAI MASATAKA;ARIMOTO HIDEO;TADA SATORU
分类号 H01S5/022;H01S5/026 主分类号 H01S5/022
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