摘要 |
The layer structure of a cutting plate produced according to a chemical vapor deposition CVD method contains a thick outer covering layer of medium temperature (MT) TiCN, and a multilayer Al<SUB>2</SUB>O<SUB>3 </SUB>layer arranged beneath the covering layer. Said multilayer Al<SUB>2</SUB>O<SUB>3 </SUB>layer consists of, at least, two aluminum oxide layers between which TiCN layers, and optionally TiAlC-NO layers for improving adhesion, are arranged. One such overall design has especially good chip removal properties.
|