| 摘要 |
An anisotropic conductive film bonding apparatus and a method using a laser beam instead of thermal welding using a hot bar are disclosed. The apparatus includes a light source for generating a laser beam, a laser beam transmitter for guiding the laser beam from the light source to project the laser beam onto a connecting portion, a jig, on which the substrate, the ACF, and the material are accumulated, for projecting the laser beam on the accumulated material, a manipulation panel, and a controller for setting intensity and projection manner of the laser beam and pressure and for controlling overall operation of the apparatus. The process using the hot bar as a heat source for the connection of the anisotropic conductive film is replaced with the process using a diode laser, so that reliability and precision of the process can be achieved, the processing time can be also reduced, and full-automated process can enhance productivity
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