发明名称 IC SOCKET AND IC PACKAGE MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an IC socket with a structure in which a contact and a land contact by metal and coping with multiple pins, fine pitch, large current, and high speed. SOLUTION: The IC socket is provided with a plurality of contacts 1 having spring parts in which a conductive material is wound with an effective winding number of one or more centered on a winding axle and arm parts at both ends of the spring parts, and a housing 20 in which contact insertion holes in which contacts 1 are inserted with their spring parts compressed in winding axle direction are provided in the same number of the contacts so that the adjoining coils of the spring part may contact to be conducted. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008027759(A) 申请公布日期 2008.02.07
申请号 JP20060199538 申请日期 2006.07.21
申请人 FUJIKURA LTD 发明人 NIKAIDO SHINICHI;MIYAZAWA HARUO;YAMAGAMI KATSUYA
分类号 H01R33/76;H01R13/03;H01R13/24 主分类号 H01R33/76
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