| 摘要 |
PROBLEM TO BE SOLVED: To provide a deposition film in which the occurrence of delamination is prevented even when the adhesion between a polypropylene film and a deposition layer of an inorganic oxide is strengthened to for a package. SOLUTION: In the deposition film, the inorganic oxide deposition layer 2 of a thickness of 5-300 nm is formed on at least one side of the polypropylene film 1. Plasma pretreatment using reactive ion etching (RIE) is applied to the surface, whereon at least the deposition layer is formed, of the film 1. When the surface of the polypropylene film which is subjected to the plasma pretreatment is measured by photoelectron spectroscopy (measuring conditions: X-ray source MgKα, and output 100 W), the half-value breadth of a C-C linkage obtained from C1s waveform separation is 1.2-1.7 eV. COPYRIGHT: (C)2008,JPO&INPIT
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