发明名称 APPARATUS FOR MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To surely mount a sucked electronic component on an appropriate position of a substrate without causing the component to be brought back or the like with a simple and inexpensive structure. <P>SOLUTION: In replacing a suction nozzle 118; an apparatus for mounting the electronic component has a first air circuit (positive pressure generating means) A101 capable of generating positive pressure for releasing the suction nozzle for the suction nozzle 118 to be replaced, and a third air circuit (weak positive pressure generating means) capable of generating positive pressure weaker than that for releasing the suction nozzle for the electronic component sucked to the nozzle 118. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008027986(A) 申请公布日期 2008.02.07
申请号 JP20060195925 申请日期 2006.07.18
申请人 JUKI CORP 发明人 NISHIKAWA TAKASHI
分类号 H05K13/04 主分类号 H05K13/04
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