| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device that can prevent deformations of chip. SOLUTION: The mounting method is provided with a step of mounting a wafer via adhesive sheet on a stage and performing dicing at each chip, a step of tearing off from the adhesive sheet and picking up the chip by using a collet made up of electrostatic chuck mechanism after the dicing, and a step of placing and sticking the chip on the substrate or a frame by using the collet. COPYRIGHT: (C)2008,JPO&INPIT |
