发明名称 SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device that surely cools a seal and a lamp tube. SOLUTION: A substrate processing device 10 includes a quartz tube unit 142 which encloses a lamp unit group 88, a first opening 148 formed on one side between the lamp unit group 88 and the quartz tube unit 142, a second opening 150 formed on the other side between the lamp unit group 88 and the quartz tube unit 142, a space 152 between the first opening 148 and the second opening 150, a first cooling gas blower 174 for making a cooling gas communicate from the first opening 148 to the space 152, a second cooling gas blower 176 for making the cooling gas communicate from the second opening 148 to the space 152, and a gas control unit 120 for at least controlling switching between communication of the cooling gas from the first opening 148 to the space 152 by the first cooling gas blower 174 and communication of the cooling gas between the second opening 150 to the space 152 by the second cooling gas blower. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008028305(A) 申请公布日期 2008.02.07
申请号 JP20060201852 申请日期 2006.07.25
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TANABE MITSUAKI;YANAGISAWA AKIHIKO
分类号 H01L21/26;C23C16/46;H01L21/205;H01L21/31 主分类号 H01L21/26
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