发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can more uniformly and efficiently process the entire surface of a substrate. SOLUTION: The substrate processing apparatus includes a fixed frame, a process chamber, a feed unit and a supplying unit. The fixed frame supports an end of a substrate. The process chamber houses the fixed frame to which a substrate is attached. The feed unit is located in the process chamber and supports an end portion of the fixed frame to transport the fixed frame into the process chamber. A pair of supplying units is disposed opposing at a predetermined distance from the respective faces of the substrate attached to the fixed frame transported by the feed unit, and simultaneously supplies a fluid to the faces of the substrate. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008026859(A) 申请公布日期 2008.02.07
申请号 JP20070006976 申请日期 2007.01.16
申请人 SAMSUNG ELECTRONICS CO LTD;FNS TECH CO LTD 发明人 CHOI HO-GEUN;KANG HEUNG-KYOU;KIM YONG-WOO;KIM PAL-KON
分类号 G09F9/00;G02F1/13 主分类号 G09F9/00
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