| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that is excellent in heat resistance, mechanical strengths, flame retardancy, adhesion property and electric properties (dielectric properties) and is suitable as an information communication-related material such as a resin for an insulated substrate, and electronic equipment. SOLUTION: The thermosetting resin composition comprises at least a polymer (A) having a cage-shaped silsesquioxane group covalently bonded thereto and a thermosetting resin (B). COPYRIGHT: (C)2008,JPO&INPIT
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