发明名称 |
Circuit board structure with capacitors embedded therein and method for fabricating the same |
摘要 |
A circuit board structure with capacitor embedded therein and method for fabricating the same are disclosed, especially a core structure with capacitors embedded therein and method for fabricating the same. The structure comprising: a core board having a dielectric layer with a first surface and an opposite second surface; at least one high dielectric coefficient material layer formed in the dielectric layer, wherein a first electrode plate formed on the other surface of the high dielectric coefficient material layer; a first circuit layer formed on the first surface of the dielectric layer; a second circuit layer formed on the second surface of the dielectric layer and having a second electrode plate corresponding to the first electrode plate; and a first conductive via formed in the dielectric layer and electrically connecting the first electrode plate and the first circuit layer.
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申请公布号 |
US2008030965(A1) |
申请公布日期 |
2008.02.07 |
申请号 |
US20070701441 |
申请日期 |
2007.02.02 |
申请人 |
PHOENIX PRECISION TECHNOLOGY CORPORATION |
发明人 |
LIEN CHUNG-CHENG;YANG CHIH-KUI |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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