摘要 |
Provided is a method for forming a resist lower layer material for use in a multilayer resist process, especially two-layer resist process or three-layer resist process, having a function of neutralizing an amine contaminant from a substrate, thereby reducing a harmful effect such as trailing skirts of a resist pattern of an upper layer resist. Specifically, there is provided a material for forming a lower layer of a chemically amplified photoresist layer comprising a crosslinkable polymer and a thermal acid generator that can generate an acid by heating at 100° C. or greater and is represented by the general formula (1a): <?in-line-formulae description="In-line Formulae" end="lead"?>R<SUP>1</SUP>CF<SUB>2</SUB>SO<SUB>3</SUB><SUP>-</SUP>(R<SUP>2</SUP>)<SUB>4</SUB>N<SUP>+</SUP>, (1a)<?in-line-formulae description="In-line Formulae" end="tail"?> as well as a resist lower layer substrate comprising a resist lower layer formed using said material.
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