| 发明名称 |
On-Chip Magnetic Components |
| 摘要 |
An integrated circuit chip comprising a bond wire and a mass of magnetic material provided on the bond wire, wherein the mass of magnetic material increases the inductance of the bond wire.
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| 申请公布号 |
US2008029845(A1) |
申请公布日期 |
2008.02.07 |
| 申请号 |
US20070835144 |
申请日期 |
2007.08.07 |
| 申请人 |
UNIVERSITY OF CENTRAL FLORIDA RESEARCH FOUNDATION |
发明人 |
SHEN ZHENG JOHN |
| 分类号 |
H01L29/00;H01L21/02;H01L23/49 |
主分类号 |
H01L29/00 |
| 代理机构 |
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代理人 |
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