发明名称 Transient voltage protection circuit boards and manufacturing methods
摘要 The circuit board comprises a dielectric substrate layer (602) having a plurality of holes filled with variable impedance material (618) extending through it. The variable impedance material has a relatively high impedance when subjected to a voltage or current under a predetermined threshold, and a relatively low impedance when subjected to a voltage or current above the threshold. The circuit board further can have an anisotropically conducting transmission layer (606), a circuit layer (608) and a ground plane (604).
申请公布号 GB2440662(A) 申请公布日期 2008.02.06
申请号 GB20070014820 申请日期 2007.07.31
申请人 COOPER TECHNOLOGIES COMPANY 发明人 HUNDI PANDURANGA KAMATH
分类号 H01C7/12;H05K1/02 主分类号 H01C7/12
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