| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology capable of easily providing an MCP structure semiconductor device with the use of a general purpose semiconductor device, and freely fixing the intended semiconductor device even after the MCP package sealing. <P>SOLUTION: The semiconductor device with a semiconductor chip 101 and a plurality of external connection terminals drawn from the semiconductor chip 101 to the periphery sealed by a packaging member 102 comprises a first external connection terminal 108 for electrically connecting the printed-circuit board 105 for mounting the semiconductor device, and a second external connection terminal 111 for electrically connecting the semiconductor device and a second semiconductor device 104. The connection with the second semiconductor device 104 with the use of the second external connection terminal 111 can easily provide a multi-chip structure to be able to use the general purpose semiconductor device for the second semiconductor device, even after the semiconductor device's package sealing or a mounting to a wiring board such as a mother board. <P>COPYRIGHT: (C)2008,JPO&INPIT |
