发明名称 MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE ELEMENT
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of pyroelectric breakdown of an interdigitated electrode or the like while uniformly forming a thickness of a wiring pad. SOLUTION: A manufacturing method of a surface acoustic wave element has an etching step in which a reflector and the interdigitated electrodes 13, 14 are formed on a piezoelectric substrate 12 by etching a metal film and a conduction pattern is formed by a residue of the metal film 21, an SiO<SB>2</SB>film forming step for film-forming an SiO<SB>2</SB>film 23 on the whole face of the piezoelectric substrate, an SiO<SB>2</SB>film removing step for removing a part equivalent to an electrode forming region in the SiO<SB>2</SB>film 23 so as to form the electrode forming region by a part of the exposed metal film, a wiring electrode forming step for forming a wiring electrode 16 on the electrode forming region by using electrolytic plating, and a film removing step that removes a part to be left as a wiring pattern in the conduction pattern, the SiO<SB>2</SB>film 23 in the region other than the reflector 19 and interdigitated electrodes 13, 14, and an auxiliary pattern 99. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007325034(A) 申请公布日期 2007.12.13
申请号 JP20060153971 申请日期 2006.06.01
申请人 ALPS ELECTRIC CO LTD 发明人 MEGURO TOSHIHIRO;MURATA SHINJI
分类号 H03H3/08;H03H9/145 主分类号 H03H3/08
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