THERMALLY ENCHANCED BGA PACKAGES AND METHODS

摘要

Improved ball grid array (BGA) packages (100) are disclosed in which thermal properties are enhanced by means of a heat channel through the substrate (102). The heat channel element is patterned for receiving solder balls. A BGA embodiment of the invention includes an integrated circuit (IC) chip operably coupled to a semiconductor substrate having a top surface (104) for receiving the IC chip (108) and a bottom surface (110) defining the perimeter of the bottom of the package. An encapsulant encloses the IC chip and at least a portion of the top surface of the substrate, defining the top and sides of the package. The substrate includes a heat channel aperture (112) for receiving heat channel element (114) having a surface proximal to the IC chip and having an opposing surface defining at least an interior portion of the bottom surface of the package and patterned for receiving solder balls. Methods for assembling packages according to the invention are also disclosed in which a substrate is provided with a heat channel aperture and heat channel element is placed therein. The substrate and heat channel element are temporarily held in position, preferably using tape, during assembly. Solder ball attachment points are provided at the surface of the heat channel element for receiving solder balls.