发明名称 CONTACT LOAD PROFILE MODIFICATION FOR A COMPRESSION SOCKETED CPU
摘要 A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and wherein a first shim is interposed between the bottom portion and the second clamping hardware.
申请公布号 US2007285888(A1) 申请公布日期 2007.12.13
申请号 US20070844935 申请日期 2007.08.24
申请人 SUN MICROSYSTEMS, INC. 发明人 KEARNS DONALD A.;ZACHARISEN GEORGE C.;MCELFRESH DAVID K.
分类号 G06F1/16;G01B21/02;G01G19/00;G06K9/36 主分类号 G06F1/16
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