发明名称 |
KUPFERFOLIE MIT HARZ SOWIE DAMIT HERGESTELLTE BEDRUCKTE LEITERPLATTEN |
摘要 |
<p>An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: a. a high polymer having cross-linkable functional groups in the molecule, and a cross-linking agent therefor 5 to 30 parts by weight b. an epoxy resin that is liquid at room temperature 5 to 30 parts by weight c. a compound having the structure shown in Formula 1 40 to 90 parts by weight <CHEM> where R is H or <CHEM></p> |
申请公布号 |
DE60223220(D1) |
申请公布日期 |
2007.12.13 |
申请号 |
DE2002623220 |
申请日期 |
2002.05.30 |
申请人 |
MITSUI MINING & SMELTING CO. LTD. |
发明人 |
SATO, TETSURO;ASAI, TSUTOMU;MATSUSHIMA, TOSHIFUMI |
分类号 |
C08L63/00;B32B15/08;C08G59/62;C08L61/10;C08L101/00;C09D163/00;H05K1/03;H05K3/46 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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