| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad, preventing a polishing layer and a substrate layer from being separated in spite of using under a severe polishing condition. <P>SOLUTION: This polishing pad 11 includes: a polishing layer 13 brought into contact with a material 12 to be polished to polish the material 12 to be polished; the substrate layer 14 supporting the polishing layer 13; and an adhesive layer 15 for making the polishing layer 13 and the substrate layer 14 adhere to each other. The polishing layer 13 is provided with a first through hole 16 formed in the central part, thereby preventing separation of the polishing layer 13 from the substrate layer 14 due to deformation of the polishing layer 13. On the other hand, the substrate layer 14 is provided with a second through hole 17 formed in the central part, whereby the substrate layer 14 is easily deformed following the deformation of an inner wall part facing the first through hole 16 so as to prevent separation of the polishing layer 13 from the substrate layer 14 due to deformation of an inner wall part facing the first through hole 16. Further, a third through hole 18 is provided with a hole internal member having a height at least equal to that of the second through hole 17, thereby preventing slurry from entering the substrate layer 14. <P>COPYRIGHT: (C)2008,JPO&INPIT |
