| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible wiring circuit board which causes no deterioration of patterning accuracy and less pattern fault, and is relatively easy to downsize its production equipment and its lead time can be relatively shortened and can be cut out by laser cutting method, even if the pattern pitch of the flexible wiring circuit board is made extremely small. SOLUTION: The flexible wiring circuit board in which a wiring circuit is formed on an insulating polyimide supporting film is produced by (aa) stacking a conductive layer on a transparent rigid substrate through a polyimide precursor adhesive layer, (bb) patterning the conductive layer to form a wiring circuit, (cc) imidizing the polyimide precursor adhesive layer to form an insulating polyimide supporting film, and (dd) stripping the polyimide film with the wiring circuit away from the transparent rigid substrate. COPYRIGHT: (C)2008,JPO&INPIT |
