发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To secure the resistance of an IC chip for mass production against noise, even if the resistance of the IC chip for mass production against noise tends to be deteriorated due to each chip size when the IC chip used in development in a control substrate section is changed to the IC chip for mass production. SOLUTION: The IC chip 230 for mass production has a variable noise filter section 233. By inputting communication data signals (noise removal data) stored in a master ECU 100 in advance to a communication circuit section 232 in the IC chip 230 of the control substrate section 200, the impedance of the variable noise filter section 233 is changed by the communication circuit section 232, so that the IC chip 230 satisfies reference noise resistance. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007324177(A) 申请公布日期 2007.12.13
申请号 JP20060149593 申请日期 2006.05.30
申请人 DENSO CORP 发明人 NODA SHINICHI;FUJINO TSUYOSHI
分类号 H01L21/822;H01L27/04 主分类号 H01L21/822
代理机构 代理人
主权项
地址