摘要 |
PROBLEM TO BE SOLVED: To provide a cooling duct for electronic equipment, wherein the manufacturing cost is reduced and air discharge direction is easily changed if necessary in shipment or in use. SOLUTION: A resin mold has a pair of plates 14 and 16 disposed opposite to each other with a predetermined distance between them, and a plurality of partitions 18 disposed between the pair of plates at predetermined intervals. Thus, the plates 14 and 16 and partitions 18 form at least one series of passages extending parallel to each other. The cooling duct is formed from the resin mold 10 in which at least the one series of passage is bent into an almost L-shape. COPYRIGHT: (C)2008,JPO&INPIT
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