| 摘要 |
A low viscosity capillary flow underfill composition having improved filler dispersion and cure rate. One embodiment of the composition comprises one or more epoxy resins, such as cycloaliphatic epoxy resins, one or more catalysts, such as super acid catalysts and one or more inert components, which may comprise diluents such as non-electrically conductive fillers. Further embodiments of the invention include compositions further comprising low viscosity non-epoxy reactive diluents, such as vinyl ether, and polyols such as polyester polyols. A further embodiment is a method of assembling an electronic component utilizing the low viscosity underfill composition of the present invention. A still further embodiment is an electronic device or component containing the underfill composition of the present invention.
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