COPPER ELECTROPLATING OF PRINTING CYLINDERS

摘要

The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source, of copper ions; (b) a source of methane sulphonate ions; (c) a source of chloride ions; (d)an organosulphur compound having the formula R-S-R' -SO₃"X⁺ or X⁺-O₃S-R'S-R-S-R' -SO₃- X⁺, wherein R is alkyl, hydroxyalkyl or alkyl ether, R' is a C₂-C₄ alkyl group, and X⁺ is a cation; and (e) a polyether compound and method of using the same. The copper plating bath produces a plating deposit that has a stable hardness and is free from self-annealing during high speed plating.