发明名称 |
FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME |
摘要 |
A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes ("LEDs") and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith. |
申请公布号 |
EP1498013(B1) |
申请公布日期 |
2007.12.12 |
申请号 |
EP20030717949 |
申请日期 |
2003.03.10 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
BECKER, CHARLES, ADRIAN;WEAVER, STANTON, EARL;STECHER, THOMAS, ELLIOT |
分类号 |
H05K1/02;H01L23/367;H01L25/075;H01L33/62;H05K1/18;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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