| 摘要 |
<p>This invention provides an epoxy resin composition that can provide a printed wiring board having excellent heat resistance, adhesion, prepreg storage stability, and insulation reliability. The epoxy resin composition comprises (A) an oxazolidone ring-containing epoxy resin, (B) a novolak-type epoxy resin, (C) a guanidine derivative, and (D) imidazoles and is characterized in that the component (A) simultaneously contains an oxazolidone ring and an isocyanuric ring, the IR absorbance ratio of the isocyanuric ring to the oxazolidone ring is not less than 0. 01 and not more than 0.1, the weight ratio between the component (A) and the component (B) is 5 : 95 to 95 : 5, the content of the component (C) and the content of the component (D) are 0.01 to 5 parts by weight and not more than 0.08 part by weight, respectively, based on 100 parts by weight in total of the weight of the epoxy resin containing the components (A) and (B), and the content of bromine based on a weight obtained by subtracting the weights of the components (C) and (D) from the weight of the resin composition is not less than 10% by weight and not more than 20% by weight.</p> |
