WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE

摘要

A wiring substrate, a manufacturing method thereof and a semiconductor device are provided to adhere a protruding electrode firmly on the wiring substrate by forming the protruding electrode on the insulative material having a deeply recessed structure from the surface of the insulative material or the adhesive layer toward the inside. A wiring substrate includes an insulative material(2), an adhesive layer(3), a conductor wiring(4), a protruding electrode(5). The adhesive layer is formed on a surface of an insulative material. The conductor wiring is formed on the surface of the adhesive layer. The protruding electrode is formed at a region on the adhesive layer of both sides of the conductor wiring crossing the longitudinal direction of the conductor wiring.