EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

An epoxy resin composition for packaging a semiconductor device and a semiconductor device packaged by using the composition are provided to improve flame retardancy without the corrosion of a semiconductor chip and a lead frame and to prevent the generation of harmful by-products in case of burning. An epoxy resin composition comprises 3-15 wt% of an epoxy resin; 0.1-10 wt% of a curing agent; 0.001-1 wt% of a curing accelerator; 70-95 wt% of an inorganic filler; and 1-5 wt% of muscovite and talc as a nonhalogenated flame retardant. Preferably the epoxy resin comprises a phenol aralkyl type epoxy resin represented by the formula 3 (wherein the average of n is 1-7); and the curing agent comprises a phenol aralkyl type phenol resin represented by the formula 4 (wherein the average of n is 1-7).