METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

An apparatus for fabricating a semiconductor device is provided to effectively avoid deformation of a columnar electrode in a sealing process by supporting the upper part of a semiconductor substrate by a mold in making a cavity vacuum while the semiconductor substrate is separated form a sealing resin material so that resin doesn't come in contact with the columnar electrode. A first mold(100) has a substrate mounting surface(120a) for supporting a semiconductor substrate. A sealing apparatus(300) includes the first mold and a second mold confronting the first mold. The center point of a confronting surface of the second mold to the substrate mounting surface of the first mold becomes a second center point(C2) confronting a first center point(C1) of the substrate mounting surface. A protrusion(230) of a convex type is formed in the second mold wherein the top point or top surface of the protrusion is positioned in the second center point. A resin disposition region(230a) is formed in a region including the top point of the protrusion point or in the top surface of the protrusion.